Molybdenum copper, tungsten copper, CMC and CMCC materials, combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate, thermal control and heat insulation components (heat sink materials) and the lead frame in large-scale integrated circuit and high power microwave devices.
Power semiconductor package pipe
IGBT module
Specification: bared, coated with nickel and gold.
Specification: Bared and coated with Nickle, gold.
Specification: We can provide all kinds of products with different thickness and layers to meet customers various requirements.
Typical properties table of heat sink products:
Product
Components[wt%]
Density[g/cm3]
Coefficient of Heat expansion[10-6/K]
Heat conductivity[W/(m·K)]
CMCC141
Cu/MoCu30/Cu
9.5±0.2
7.3/10.0/8.5
220
CMCC232
Cu/MoCu30/Cu
9.3±0.2
7.5/11.0/9.0
255
CMCC111
Cu/MoCu30/Cu
9.2±0.2
9.5
260
CMCC212
Cu/MoCu30/Cu
9.1±0.2
11.5
300
CMC111
Cu/Mo/Cu
9.3±0.2
8.3
305(surface)
250(thickness)
S-CMC51515
Cu/Mo/Cu/Mo/Cu
9.2±0.2
12.8
350(surface)
295(thickness)
No-Oxgen Cu TU1
Cu
8.93
17.7
391
1:4:1
2:3:2
1:1:1
2:1:2
1:1:1
6.4(20~800℃)
5:1:5:1:5
6.1(20~800℃)
Advantage: our molybdenum electric piece has excellent thermal conductivity and electrical conductivity, high thermal expansion coefficient and substrate match, so it can provide customers with bare chip and coating products. Products are widely used in electric power semiconductor devices of high power thyristor, and fast thyristor.